matlab-model-via

Model signal and ground return vias for multi-layer PCB transitions in MATLAB.

883|109|Updated Apr 3, 2026
One-click install
npx skills add https://github.com/matlab/matlab-agentic-toolkit --skill matlab-model-via
Or copy as Structured Prompt for Agent
Please help me install this Agent Skill.
Skill: matlab-model-via
Source: https://github.com/matlab/matlab-agentic-toolkit/tree/main/skills-catalog/rf-and-mixed-signal/matlab-model-via
Command: npx skills add https://github.com/matlab/matlab-agentic-toolkit --skill matlab-model-via

SYSTEM DOCUMENTATION & REQUIREMENTS

What problem does it solve?

It helps you create accurate MATLAB RF PCB via models so your agent can predict signal integrity through multi-layer via transitions without guessing geometry or using the wrong workflow.

Core Features & Use Cases

  • Model signal vias through multi-layer stackups using viaSingleEnded (signal pads/antipads and ground return vias).
  • Place ground return vias (GRVs) to control return-path inductance and reduce resonance risk for high-speed links.
  • Analyze via performance for signal integrity by extracting S-parameters and using criticalwavelength or gapratedistance to evaluate GRV adequacy across a target frequency band.

Quick Start

Use matlab-model-via to define the viaSingleEnded geometry, place ground return vias, and run S-parameter and resonance-risk checks for a via transition in your MATLAB RF PCB workflow.

Frequently Asked Questions about matlab-model-via

High-intent search queries and answers about installing and using this skill.

FAQPage Schema
How do I model high-speed via transitions in MATLAB to extract S-parameters?

Model high-speed via transitions in MATLAB by defining the viaSingleEnded geometry with correct signal pads, antipads, and ground return vias. This allows you to extract S-parameters and evaluate signal integrity through multi-layer PCB stackups.

How does ground return via placement affect signal integrity in RF PCB designs?

Ground return via placement controls return-path inductance in RF PCB designs. Proper GRV placement reduces resonance risk in high-speed links by ensuring adequate return current paths across target frequency bands.

Can I use criticalwavelength and gapratedistance to evaluate ground return via adequacy for multi-layer PCBs?

Yes, you can use criticalwavelength and gapratedistance to evaluate ground return via adequacy in multi-layer PCBs. These metrics help assess resonance risk and determine if GRV spacing is sufficient for your target frequency band.

What is the correct input format for specifying via locations when modeling signal integrity?

The correct input format for specifying via locations is [x y startLayer stopLayer]. This ensures the viaSingleEnded setup uses proper signal and ground layer conventions for accurate multi-layer transition modeling.

Does this MATLAB via modeling workflow handle general signal integrity and power delivery network analysis?

No, this MATLAB via modeling workflow skips general signal integrity, transmission-line design, EM, and PDN workflows. It specifically targets via-focused signal integrity through layer transitions using viaSingleEnded and GRV placement.

Why do my PCB via models show incorrect geometry when transitioning between layers?

PCB via models show incorrect geometry when signal and ground layer conventions are misapplied. Defining the viaSingleEnded geometry with accurate [x y startLayer stopLayer] locations and proper antipads prevents incomplete via transitions.