datasheet

Audit IC datasheet numeric claims against spec bundles and LaTeX markers.

1|Updated Nov 2, 2025
One-click install
npx skills add https://github.com/rjwalters/bucket-brigade --skill datasheet-rjwalters
Or copy as Structured Prompt for Agent
Please help me install this Agent Skill.
Skill: datasheet
Source: https://github.com/rjwalters/bucket-brigade/tree/main/.anvil/skills/datasheet
Command: npx skills add https://github.com/rjwalters/bucket-brigade --skill datasheet-rjwalters

SYSTEM DOCUMENTATION & REQUIREMENTS

What problem does it solve?

Customer-facing IC datasheets are high-stakes documents where a single wrong number can cause a board spin. Hand-authoring them introduces errors like contradictory specs, double-assigned pins, unrepresentable bus widths, silent spec changes, and pre-silicon values presented as final. This skill encodes the cleanup process distilled from real preliminary datasheets, ensuring every number traces to an authoritative source and passes mechanical integrity checks before reaching a customer.

Core Features & Use Cases

  • Mandatory spec source-of-truth audit: Every numeric claim is back-checked against a spec bundle (model exports, RTL parameters, quant configs, foundry quotes) with a four-valued verdict schedule.
  • Deterministic mechanical pre-flight: Pin-map integrity (every pin assigned exactly once) and bus-width sanity (N-bit fields cover their claimed ranges) are checked automatically via machine-readable markers in the LaTeX source.
  • Canonical lifecycle with parallel critics: Runs draft → review + audit (both required) → revise → READY/AUDITED, with a 9-dimension /44-point rubric and a ≥39 advance threshold for customer-facing quality.
  • Shared-die SKU coherence: For multi-SKU families, the audit cross-reads sibling datasheets to ensure shared specs (process, die, package, abs-max) remain identical across the family.

Quick Start

Use the datasheet skill to produce a customer-facing IC datasheet by providing a thread brief and spec bundle, then run the parallel review and audit commands to validate every number and mechanical constraint before shipping.

Frequently Asked Questions about datasheet

High-intent search queries and answers about installing and using this skill.

FAQPage Schema
How do I audit an IC datasheet to ensure numeric accuracy and pin-map integrity?

To audit an IC datasheet, you back-check every numeric claim against a spec bundle and perform mechanical pre-flight checks via LaTeX markers to verify pin-map integrity and bus-width validity before customer release.

What is a spec source-of-truth audit for semiconductor technical documentation?

A spec source-of-truth audit validates every numeric claim in an IC datasheet against authoritative sources like model exports and RTL parameters, assigning a four-valued verdict to prevent contradictory specs and silent spec changes.

How do I check for double-assigned pins and bus-width errors in LaTeX datasheets?

You check for double-assigned pins and bus-width errors by using deterministic mechanical pre-flight checks that read machine-readable LaTeX marker comments to ensure every pin is assigned exactly once and N-bit fields cover claimed ranges.

Can I use this datasheet workflow for shared-die multi-SKU component families?

Yes, the datasheet workflow supports shared-die SKU coherence by cross-reading sibling datasheets during the audit to ensure shared specs like process, die, package, and absolute maximums remain identical across the product family.

What is the quality threshold for a customer-facing IC datasheet revision?

The quality threshold for a customer-facing IC datasheet is a 9-dimension, 44-point rubric requiring a minimum score of 39 points to advance from the revision stage to the READY/AUDITED lifecycle state.

How do I label pre-silicon projected values versus measured specs in a datasheet?

You label pre-silicon projected values versus measured specs by enforcing measured-versus-projected provenance labeling during the mandatory audit, ensuring preliminary values are never incorrectly presented as final silicon results.